Topic of Keynote Speech: CFD Challenges in Wave Soldering Process
 

Abstract:  Soldering is one of the most significant factors in development of pin-through-hole (PTH) technology, especially toward the lead-free and miniaturization of the advanced electronic package. Moreover, inadequate thermal and stress profiles causes the reliability issues in manufacturing assembly process. The purpose of this study is to develop a thermal coupling model that used to investigate the temperature and thermal stress response of sample electronic boards (at board and package level) during the PTH process. The numerical method comprised the computational fluid modeling of the PTH internal flow was coupled with the structural heating modeling in the PTH components. The Multi-physics Code Coupling Interface (MpCCI) was used as the coupling software, i.e. Fluent and Abaqus software. The model was validated with experimental measurements. The simulations are conducted for both at board and package levels. The simulation and experimental results show that the thermal profiles of the soldering process are almost identical. However, simulation of voids and phase changes are remain challenges in this study